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TechConnect Summit 2006
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Producing Sponsor


Platinum Sponsor

Welsh & Katz, Ltd.

Gold Sponsor

ISTC International Science & Technology Center

Ventures Enabling Sponsor

Atomic Venture Partners

Press Sponsor

Business Wire

Partnering Sponsor


Supporting Organizations

Boston University
Midwest Research University Network

Media Sponsors

(joint with Nanotech 2006) Nature
R&D Magazine

Summit News

Event Contact

Jennifer Rocha
955 Massachusetts Ave. #313
Cambridge, MA 02139
Phone: (774) 249-8514

ChemNova Technologies, Inc.

Location:Illinois, US
Speaker:Chhiu-Tsu Lin
Title:Presidential Research Professor & Distinguished Teaching Professor
Primary Industry:Materials
Executive Summary:An innovative device, called molecular fan, is presented. Currently, electrical components are cooled by conduction of heat to a heat sink, which is cooled by air/liquid convection. As technology progresses and silicon chips have more components in a smaller area, the heat produced by the chips per volume will increase. Simple convection will not be able to keep up with this increased heat density. Recently, Intel tried to launch a paired CPU but failed due to its inability to lower the system’s equilibrium temperature by 4 oC. Molecular fan is an innovative heat dissipation thin film coatings, having functionalized nanoparticles, where the coated surface displays an assembly of active molecular vibrational groups which can act as a molecular cooling fan by emitting IR radiation. The functionalized molecular functional groups on the surface of nanparticles, when heated or excited, can act as selective emitter and display an enhanced emissivity. Our molecular fan device on aluminum, copper, and steel substrates can effectively lower the equilibrium temperature by 9-13 oC. An IR image shows that the IR emission of heated molecular vibrations in molecular fan emits perpendicularly and away from the heat sources.
Venture is:A-Round


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