Early Stage Company Review

The TechConnect 2007 Early Stage Company Review provides an ideal forum for “seed” to “early-stage” companies to showcase their technologies, market advantages, and to search for funding.

Companies selected by the TechConnect 2007 Vetting Team are given 15 minutes to present and will have on-site networking with the TechConnect 2007 Vetting Team, corporate capital, venture and multi-sector investment attendees all reviewing from the audience.

Participation is limited to the top 200 vetted/scored companies and all presenting company officials must be registered TechConnect 2007 attendees.

To Participate:

Please submit an executive summary of your company for review by the TechConnect 2007 Vetting team by completing our submission form:

Important Dates

Proposals due: March 10^th
Notifications: March 20^th
On-site review: May 23-24^th

Participation Limitations

Submission Guidelines

When you complete the online submission form, you are submitting your IP or Venture for Board review and possible presentation at the TechConnect Summit, to be held May 23-24, 2007, at the Santa Clara Convention Center, CA, USA.

All required fields (marked with a *) must be completed. The required fields comprise key information that assists the Board in reviewing your submission properly. Submissions that have missing information in required fields will not be reviewed for Summit consideration.

Accepted Submissions

If your IP or Venture is selected for presentation at the TechConnect Summit, we will notify you by email. All presenters are expected to pre-register no later than April 1, 2007, at: http://www.techconnect.org/Summit2007/register.html

There is a fee to present at the Summit. The registration fee includes:

Cumulative feedback on your submission from the TechConnect Board review team
Listing of IP or Venture executive summary in printed Program Guide and Summit web pages
Access to all TechConnect Sessions, Networking Events, and Luncheons
Access to Nanotech 2007 Conference and Trade Show (May 21-24), co-located with TechConnect at the Santa Clara Convention Center.
Access to networking software that allows you to connect with attendees for networking or meeting purposes

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2006 Presenting Venture Companies

	Aerospace & Defense Block MEMS Digital Solid State Propulsion
	Agro Sequoia Pacific Research Company
	Chemicals Nanox Silver Clear
	Energy Catalyzed Combustion Technologies Cryscade Solar Ltd. Enable IPC Corporation HTS Nano-Ceramics, Ltd NanoCell Systems NanoDynamics orionsolar photovoltaics Prism Solar Technologies Solexant Corp.
	Electronics IC Scope Research Maritime Design NanoOpto Corp. Owlstone Nanotech Phoebus Optoelectronics Progressive Cooling Solutions Silk Displays Smoltek AB
	Health Care & Medical Devices Active Surface Technologies Incorporated Argonide Corp GEMIO Technologies GeneEx ICU DataSystems Medical Ink Jet technologies Nano Interface Technology Nanogen NanoLambda Nanomix Nanopoint Silicon Biosystems Spa

	Materials Anchor Science Chela Tech ChemNova Technologies Delphi Laboratories HSM Systems Liquidia Technologies Mantis Deposition Nanometrix Quantiscript SouthWest NanoTechnologies Tekna Plasma Systems
	Pharma & Biotech Alnis BioSciences Carigent Therapeutics EP Therapeutics NanoBioMagnetics Nanolytics Nanospherx Nucleus Remodeling Telomolecular
	Personal Care PolyMedix
	Software & Services Atomistix Quantum Modeling ScienceGL
	Instrumentation AmberWave Systems Corporation memsstar technology NanoSpire NIL TECHNOLOGY nVizix Prime Technology The Permanent Data Company
	Media iMobile Access Technologies Corp (iMAT)
	Engineering BioMimetic Systems