Thermally and Electrically Conductive Adhesive
|Organization:||NextTechs Technologies, LLC, TX, US|
|I.P. Brief:||Atlas Scientific proposes a flexible, single or double-sided adhesive film that adheres solely by vdW forces. The proposed film has abundant arrays of multiwalled carbon nanotubes (MWCNTs > 1010 cm-2) on a flexible substrate. The discovery makes the film advantageous to many applicationss that require a rapid mount.|
|Keywords:||semiconductor chip mounting, heat sinking & systems, systems that require a rapid mount|
|Specific Market:||Semiconductor and systems that require a rapid mount|
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