Carbon Nanotube-based Thermal Interface Material

Organization:University of Washington, WA, US
I.P. Brief:A process has been developed to integrate the high thermal conductivity of carbon nanotubes into a polymer matrix, thus creating a material with high thermal transport properties for laser and IC chip packaging.
Keywords:thermal management, heat transfer, integrated circuit packaging, thermal interface material
Primary Industry:Electronics
Specific Market:Laser diode and integrated circuit device packaging

Full IP Descriptions available on-site.

HIGHLIGHTS

Corporate Presentations:

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Reserved Presentations:

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Partnering Events:
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Platinum Sponsor
University of Hawaii

Press Sponsor
Business Wire

Commercialization Partner
BusinessWeek

Sponsors
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Media Sponsors
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Supporting Organizations
BirchBob
CONNECT
Boston University
Midwest Research University Network
OCTANe
AeA
LES-SVC

 

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