Carbon Nanotube-based Thermal Interface Material
|Organization:||University of Washington, WA, US|
|I.P. Brief:||A process has been developed to integrate the high thermal conductivity of carbon nanotubes into a polymer matrix, thus creating a material with high thermal transport properties for laser and IC chip packaging.|
|Keywords:||thermal management, heat transfer, integrated circuit packaging, thermal interface material|
|Specific Market:||Laser diode and integrated circuit device packaging|
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