Boleo, Inc.

Location:CA, US
Speaker:Bernardo Lucero
Title:President
Primary Industry:Telecommunications
Executive Summary:Boleo is a start-up company with proprietary technology that solves the major problem of reliablilty in RF MEMS (Radio Frequency Micro-Electro-Mechanical Systems) relays and switches. The drive to miniaturize RF devices has had an adverse effect on the reliability of RF MEMS switches because a smaller actuator delivers less force to the contacts. It is the contact force that is the main determinant for reliability and power handling capability. Our patented solution is to miniaturize the contacts on the front-side while fabricating a large actuator on the backside. It is “through-the-wafer” that we deliver a hard contact force. The benefits of our design are greater reliability, improved power handling capabilities, and less consumption of valuable front-side integrated-circuit real estate. Our business strategy is a bottom-up approach that targets the electro-mechanical relays and solid-state relays replacement market, estimated to reach $4.2 billion in 2007. We have identified a primary prospect that has immediate requirements for two million units at a price point of $20-30 each. We are seeking two rounds of funding, $700,000 for prototyping and in nine months another $700,000 for pilot production.
Venture is:Seed Level

HIGHLIGHTS

Corporate Presentations:

  • Air Products
  • BASF
  • Eastman Kodak Company
  • Genzyme
  • Goodrich
  • Hewlett-Packard
  • Honda
  • Medtronic
  • Merck
  • Sanyo

Reserved Presentations:

  • ExxonMobil
  • IBM

Partnering Events:
(full access included)

Platinum Sponsor

University of Hawaii

Press Sponsor

Business Wire

Commercialization Partner

BusinessWeek

Sponsors

Invest Australia AzTE Technology Enterprises

Media Sponsors

(joint with Nanotech 2007) Nature
Science
Red Herring

Supporting Organizations

BirchBob
CONNECT
Boston University
Midwest Research University Network
OCTANe
AeA
LES-SVC

 

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