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Hybrid Hollow Silica Particles with Unprecedentedly Low Thermal Conductivity, Oak Ridge National Laboratory
TECHNOLOGY SUMMARY
A thermal insulation material with thermal insulation properties similar to the state-of-the-art material (aerogels) at a lower cost of production. The hollow silica particles are coated with a very low thermal conductivity material.
Primary Application Area: Materials, Chemical
Technology Development Status: Prototype
TECHNOLOGY DETAILS:
Synthesized hollow particles containing a cavity filled with air and have a thin wall made of solid silica, which have an overall very low thermal conductivity (≈ 0.02 W/m.K). To further decrease the thermal conductivity, a solid with an inherently low thermal conductivity is incorporated. To minimize heat transfer due to solid conduction through the wall-to-wall contact, hollow silica particles are covered with a very low thermal conductivity material.
FIGURES OF MERIT:
Value Proposition: A material with thermal insulation properties similar to state-of-the-art materials (aerogels) at much lower cost of production.
SHOWCASE SUMMARY
Organization Type: Academic/Gov Lab