TechConnect Summit Now Accepting IP and Venture Submissions
Oct 23, 2009
TechConnect is Looking For Technology and Company Submissions in Areas of Nanotech, Cleantech, and the Life Sciences
The annual TechConnect Summit will take place June 21-25, 2010, in Anaheim, CA. As we enter our 5th year, TechConnect has become the largest conference for technology commercialization and corporate-investment partnering in North America. TechConnect is part of TechConnect World, a global technology and business marketplace for emerging technologies that also features the NSTI Nanotech and CTSI Clean Technology conferences.
The TechConnect Summit will feature pre-screened technologies and early stage companies from around the world. Universities and companies selected will present in front of a targeted audience of F1000 corporate business developers, investors, researchers, and international government agencies. All submissions are pre-screened by an Advisory Committee (have Advisory Committee link to: http://www.techconnectworld.com/Summit2010/press/board.html). representing more than 70 individuals representing leading corporations, university technology transfer offices and labs, and investment firms.
F500 Corporate Partnering:
The TechConnect program also includes the Corporate Partnering Forum, which features presentations from F500 business and science development executives on their company’s technology and investment areas of interest. Several F500 companies have already confirmed their participation for 2010 in Anaheim, including:
- BP
- Dow Chemical
- Honda
- Lockheed Martin
- Medtronic
- Merck
- Panasonic
- Sanyo
- Samsung
- Toray
How to Participate:
- IP Forum
The TechConnect IP Forum is for those that generate new technology and are looking for firms that are interested in licensing that technology, or are looking for potential investment partners to take their technology to the next stage. Those selected to present will give an oral presentation at the Summit, receive Committee feedback, and access to exclusive receptions with corporations and investors.
To submit an IP, please click here
- Venture Forum
The Venture Forum is dedicated to “seed” up to “B Round” companies to showcase their technologies, market advantages, and search for corporate partners and funders. Those selected to present will give an oral presentation at the Summit, receive Committee feedback, and access to exclusive receptions with corporations and investors.
To submit an IP, please click here
- Exhibit at the TechConnect Marketplace
The TechConnect Marketplace Expo was created exclusively for universities, start-up companies, and professional services firms to showcase technologies, products and services to conference attendees. The 2010 TechConnect Marketplace Expo will double in size from 2009, and will become the hub of the main Exhibit Hall for TechConnect World. Networking receptions with F1000 executives, extended Marketplace hours, and booth discounts for university tech transfer offices and early stage companies that present at the Summit are just a few of the new features for 2010.
- Sponsor the Summit
Companies seeking to maximize their opportunity to find technology opportunities, work with young companies, and support technology research and innovation should consider sponsoring. TechConnect has developed various sponsor levels that maximize a firm’s exposure to the technology business community and provides informational value for its sponsors. To view sponsor packages, click here.
To learn about the 2010 TechConnect Summit, including the IP and Venture submission process, Marketplace Expo, Corporate Partnering Forum, and sponsor opportunities, please visit and bookmark the 2010 TechConnect page at: http://www.techconnect.org/Summit2010/ or contact Jennifer Rocha at jrocha@techconnect.org.
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