TechConnect Summit: Submissions Now Open!

TechConnect Attracts Global Audience of F1000 Companies, Universities, and Start-Up Companies for Corporate Partnering and Technology Matchmaking Opportunities
p>The 5th annual TechConnect Summit will take place June 21-25, 2010, in Anaheim, CA. TechConnect is the largest conference for technology commercialization and corporate-investment partnering in North America. TechConnect is a part of TechConnect World, a global conference platform for emerging technologies that also includes NSTI Nanotech, CTSI Clean Technology, MicroTech, and BioNano conferences.

The TechConnect Summit features peer-reviewed technologies and early stage companies from around the world in more than a dozen industry sectors. Universities and companies selected for the conference present to a targeted audience of F1000 corporate business and science developers, investors, researchers, and international government agencies.

All submissions are reviewed by an Advisory Committee of more than 70 individuals representing F500 corporations, university technology transfer offices and labs, and investment firms.

Fortune 500 Corporate Partnering Program
TechConnect features the Corporate Partnering Forum, where F500 business and science development executives present their company’s technology and investment areas of interest. Several F500 companies have already confirmed their participation for 2010 in Anaheim, including:

How to Participate:

Submit an IP
The TechConnect IP Forum is for those that generate new technology and are looking for firms that are interested in licensing that technology, or are looking for potential investment partners to take their technology to the next stage. Those selected to present will give an oral presentation at the Summit, receive Advisory Committee feedback, and access to exclusive receptions with corporations and investors.

To submit an IP, please click here. The deadline to submit is February 12, 2010.

Submit a Venture
The Venture Forum is dedicated to “seed” up to “B Round” companies to showcase their technologies, market advantages, and search for corporate partners and funders. Those selected to present will give an oral presentation at the Summit, receive Committee feedback, and access to exclusive receptions with corporations and investors.

To submit a Venture, please click here. The deadline to submit is February 12, 2010.

Exhibit at TechConnect
Special Pricing Available for Qualified Universities and Start-Up Companies

The TechConnect Marketplace Expo was created exclusively for universities, start-up ventures, and companies to showcase technologies, products and services to conference attendees. The 2010 TechConnect Marketplace Expo is the hub of the main Exhibit Hall for TechConnect World. Networking receptions with F1000 executives, extended Expo hours, and booth discounts for university tech transfer offices and early stage companies that present at the Summit are just a few of the new features for 2010. To learn more, click here.

Become a Sponsor
Companies seeking to maximize their opportunity to find promising technologies, work with young companies, and support technology research and innovation should consider sponsoring the Summit. TechConnect has developed various sponsor levels that maximize a firm’s exposure to the technology business community and provides informational value for its sponsors. To view sponsor packages, click here.

To learn about the 2010 TechConnect Summit, including the IP and Venture submission process, Marketplace Expo, Corporate Partnering Forum, and sponsor opportunities, please visit and bookmark the 2010 TechConnect page at: http://www.techconnect.org/Summit2010/ or contact Jennifer Rocha at jrocha@techconnect.org.

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