TechConnect Summit-IP and Venture Submissions Now Open! Deadline to Submit is February 12, 2010

TechConnect Brings Together a Global Audience of F1000 Companies, Universities, and Young Companies for Corporate Partnering and Technology Matchmaking Opportunities

The next TechConnect Summit will take place June 21-25, 2010, in Anaheim, CA. TechConnect is the largest conference for technology commercialization and corporate-investment partnering in North America. TechConnect is pleased to be part of TechConnect World, a global conference platform for emerging technology development and commercialization that also includes NSTI Nanotech, CTSI Clean Technology, MicroTech, and BioNano conferences.

The TechConnect Summit features peer-reviewed technologies (IPs) and early stage companies (Ventures) from around the world representing more than a dozen industry sectors. Universities and companies selected for the Summit present to a targeted audience of F1000 corporate business and science developers, investors, researchers, and international government agencies.

All IP and Venture submissions are reviewed by a 70+ member Advisory Committee representing F500 corporations, university technology transfer offices and labs, and investment firms from around the world.

Fortune 500 Corporate Partners
The TechConnect program features the exclusive Corporate Partnering Forum, where F500 business and science development executives present their company’s technology and investment areas of interest. More than a dozen F500 companies have already confirmed their participation for 2010 in Anaheim, including:

Applied Materials
BP
Dow
Eastman Kodak
Fuji Electric*
Honda
Lockheed Martin
Medtronic
Merck
Omron
Panasonic*
P&G*
Sanyo
Samsung
Toray*
*New for 2010

If your F500 company is not represented here and your company would be interested in participating in the Corporate Partnering program, we have a few speaking slots available. Please contact Jennifer Rocha at jrocha@techconnect.org for more information.

How to Participate:
Submit an IP (Deadline is February 12, 2010)
The TechConnect IP Forum is for those that generate new technology and are looking for firms that are interested in licensing that technology, or are looking for potential investment partners to take their technology to the next stage. Those selected to present will give an oral presentation at the Summit, receive Advisory Committee feedback, and access to exclusive receptions with corporations and investors.

To submit an IP, please click here. The deadline to submit is February 12, 2010.

Submit a Venture (Deadline is February 12, 2010)
The Venture Forum is dedicated to “seed” up to “B Round” companies to showcase their technologies, market advantages, and search for corporate partners and funders. Those selected to present will give an oral presentation at the Summit, receive Committee feedback, and access to exclusive receptions with corporations and investors.

To submit a Venture, please click here. The deadline to submit is February 12, 2010.

Exhibit at the TechConnect Marketplace
Special Pricing Available for Qualified Universities and Start-Up Companies
The TechConnect Marketplace Expo was created exclusively for universities, start-up ventures, and companies to showcase technologies, products and services to conference attendees. Networking receptions with F1000 executives, extended Expo hours, and booth discounts for university tech transfer offices and early stage companies that present at the Summit are just a few of the new features for 2010. To learn more, please click here.

Become a Sponsor
Companies seeking to maximize their opportunity to find promising technologies, work with young companies, and support technology research and innovation should consider sponsoring the Summit. TechConnect offers sponsors benefits that maximize a firm’s exposure to the technology business community and provides high-quality industry and technology information for its sponsors. To view sponsor packages, click here.

To learn about the 2010 TechConnect Summit, including the IP and Venture submission process, Marketplace Expo, Corporate Partnering Forum, and sponsor opportunities, please visit and bookmark the 2010 TechConnect page at: http://www.techconnect.org/Summit2010/ or contact Jennifer Rocha at jrocha@techconnect.org.

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