TechConnect Summit Reviewing Final Round of IP and Early Stage Venture Submissions; Program to be Posted Next Month

Taking Place June 3-5 in Boston, TechConnect Will Feature Dozens of Technology and Early Stage Company Presentations in the Nanotech, Clean Tech, and Life Sciences Sectors
TechConnect Summit The annual TechConnect Summit is the world’s largest peer-vetted deal flow for technology Partnering, Investing and Licensing. The Summit is unique in that it brings together annually the world’s top technology transfer offices, companies, and investment firms to locate the most promising technologies and early stage companies from around the world.

TechConnect recently notified universities, research institutions, and early stage companies of their accepted submissions. The final program will be up on the TechConnect Summit website next month. All IP and Early Stage Companies have been peer-reviewed by a 70+ member TechConnect Advisory Board, which includes representatives from BASF, Cabot Corporation, Columbia University, Honda, In-Q-Tel, Medtronic, Motorola, Philips, Pfizer, Procter & Gamble, Sanyo, UCLA, Yale University, and many others.

Confirmed organizations presenting their IP at TechConnect in Boston include: Arizona Technology Enterprises, Boston University, National Cancer Institute, Science & Technology Center (Ukraine), Swiss Federal Institute of Technology (ETH Zurich), The Hong Kong Polytechnic University, UniQuest (Australia), Univalor (Canada), University of Washington, Yissum (Israel), and many more.

Confirmed early stage companies presenting at TechConnect include: CogniScent (instrumentation), NanoLambda (electronics), Prism Solar Technologies (energy), RF Nano Corporation (materials), SIMPore (pharma/biotech), UltraViolet Dioxide (chemicals), Veratag (security), Vision Dynamics (materials), and many others.

The TechConnect Summit will also feature an exclusive Corporate Needs program in which leading companies present their current and future technology needs to conference attendees. Confirmed speakers for the 2008 TechConnect Summit include: Air Products & Chemicals, BASF, Boeing, BP, Cabot Corporation, Eastman Kodak, Genzyme, Honda, Lockheed Martin, Medtronic, Merck, Omron, and Sanyo.

The Summit is also offering limited speaking opportunities through our Sponsorship levels, which provide maximum exposure for a university or company before, during, and after the Summit. To download the Media Kit, please visit: 2008 Outreach Opportunities

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