Intel’s Tri-Gate 3D Technology Will Appear in Phones by End of 2011

May 21, 2011

Intel’s “3D” chips are designed to reduce power and improve performance of devices that use 22-nm chips

The Tri-Gate chips are able to carry electrons along raised vertical strips vs. two-dimensional flat tracks. This unique method to carry electrons allows for chips to perform better and consume less energy. Intel’s 22nm Tri-Gate technology will be in handheld devices, large computers, and sensors this year, and it is expected that the Tri-Gate chips will someday replace 2-D planar transistors.

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