TechConnect Summit 2009 Brings Innovative Technologies to Top Companies

Confirmed Corporate Partnering Speakers for 2009 Include BASF, Eastman Kodak, Medtronic, Merck, Sanyo, and Many Others

The annual TechConnect Summit represents the world's largest peer-vetted deal flow for technology partnering, investing and licensing.
 The 2009 TechConnect Summit will take place May 3-7 at the George R. Brown Convention Center in Houston, TX, USA http://www.techconnect.org/Summit2009/.

The TechConnect Summit is an information and networking exchange where executives from Fortune 500 companies present technological challenges in the areas of CleanTechnology, Nanotechnology, and the Life Sciences. The TechConnect Summit will be co-located with the NSTI Nanotech and CleanTechnology conferences. Participation at TechConnect provides full access to all co-located conferences.



At the Summit, universities, research labs, corporations and venture companies present their solutions while looking for corporate development partners, licensing partners, and investment. Pre-screened presentations include IPs from universities and inventors and venture companies from seed to D Round financing. Those selected to present an IP or venture company will have the opportunity to present to a global audience of Fortune 500 companies, investors, and government funding organizations.

The Corporate Partnering Presentations provide attendees with exclusive access to learn more about F500 companies’ current and future technology needs. The Corporate Partnering program is not to be missed; the 2009 confirmed and reserved list of speakers includes:

3M
Air Products & Chemicals
BASF
Eastman Kodak
GE Healthcare
GlaxoSmithKline
      Genzyme
Honda
Medtronic
Merck
Omron
Sanyo

All submissions are reviewed by TechConnect's Advisory Board, which includes representatives from leading universities, companies, and investment firms from around the world. Both presenters and attendees have access to unique networking and match-making opportunities.

Please visit the TechConnect Summit home page for the latest updates and to submit an IP, Venture Company, or view Sponsor Opportunities. The deadline to submit is January 23, 2009. Registration opens next month.http://www.techconnect.org/Summit2009/

↑ Back to TechConnect News™

Event Spotlights

DITAC
Austin, TX, December 1-3, 2015
DES
Austin, TX, December 1-3, 2015
 

Annual Meeting

TechConnect World 2015
Washington, DC, May 22-25, 2016