Advanced Materials: TechConnect Briefs 2015Advanced Materials TechConnect Briefs 2015

Coatings, Surfaces & Membranes Chapter 8

Conducting Polymer Based Adhesives for Electrochemical Applications

H. Choi, H. Yoon
Chonnam National University, Korea

pp. 518 - 519

Keywords: polyaniline, adhesives

There has been huge demand for developing advanced materials and devices for enhanced energy storage. However, relatively little attention has been devoted so far to the development of efficient binders for electrode materials. In this work, we report the preparation of an intrinsically conductive quaternary polymer glue through the combination of polyaniline (PANI) with three additives as a ternary dopant for both conducting and gluing properties. With an optimized composition and no heat treatment process or conductive fillers, the conductive adhesive (Q-PANI) had a conductivity of 0.9 S cm−1 and excellent performance as binders for electrochemical capacitor electrodes. The maximum peel strength was 20−25% better adhesive ability than polyvinylidene fluoride insulating binder. Q-PANI with an optimized composition showed good redox properties in an acidic electrolyte. Therefore, it is further expected that the combination of conductive and adhesive characteristics will make Q-PANI a very promising conductive paste and coating agent for various applications other than as an electrode binder. It is anticipated that our PANI binder will be suitable as an adhesive for emerging all-organic flexible or wearable devices.