Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2015Advanced Manufacturing, Electronics and Microsystems TechConnect Briefs 2015

Flexible Electronics Chapter 4

Engineering nanoinks and photonic manufacturing for printable electronics

A. Hu
University of Tennessee, United States

pp. 116 - 119

Keywords: nanoink, nanopaste, photonic sintering, bonding, sensor

We have developed various nanoinks, including silver nanowires, silver nanoplates, Cu-Ag core-shell nanoparticles, graphene oxide and graphene. Gram level nanoplates are successfully synthesized through a polymer controlled hydrothermal growth. Core-shell structures are synthesized through a microwave-assisted reduction and metal displacement. Graphene are fabricated through laser reduced graphene oxide. We show that these inks are enabling for direct writing on various substrates. Also, we displayed high viscous nanopastes can be developed by further concentration of these inks and metallic nanopastes can be used for low temperature packaging of flexible electronics and power electronics operating at high temperatures. For curing printed nanoinks and nanopastes, we compared three kinds of methods: thermal sintering, photonic sintering with flash light and athermal sintering with ultrafast fiber laser irradiation. It is possible to build 3D structures by combining ink printing, flash light nanosintering and/or laser reduction.