Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2016Advanced Manufacturing, Electronics and Microsystems TechConnect Briefs 2016

WCM - Compact Modeling Chapter 8

SPICE Compact Modeling for Design of Innovative Integrated Circuits in CEA-LETI

P. Martin, L. Lucci, M. Reyboz, J.-C. Barbe
CEA-LETI, France

pp. 309 - 313

Keywords: AlGaN/GaN HEMTs, power transistors, silicon photonics, RRAM, SPICE, Verilog-A

This paper presents an overview of the recent compact modeling activity in CEA-LETI. Examples of Verilog-A modeling using the surface potential approach of field effect transistors, such as High Electron Mobility Transistors (HEMTs) AlGaN/GaN power transistors, are given. Modeling of other devices, such as silicon photonics devices and resistive RAM (RRAM, ReRAM or memristor) memories is also presented. These models are then incorporated in process design kits (PDKs) to help designers to create and optimize innovative integrated circuits using standard EDA tools.