Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2016Advanced Manufacturing, Electronics and Microsystems TechConnect Briefs 2016

WCM - Compact Modeling Chapter 8

A Hybrid Process Design Kit: Towards Integrating CMOS and III-V Devices

S.B. Chiah, X. Zhou, K.E.K. Lee, C.Y. Ng, D. Antoniadis, E.A. Fitzgerald
Nanyang Technological University, Singapore

pp. 313 - 318

Keywords: process design kit, compact model, parameterized cell, standard cell, CMOS, III-V, design rule, layout versus schematic

A hybrid process design kit (PDK) for novel integrated circuits incorporating high performance compound semiconductor materials and devices into existing production Si-CMOS compatible foundry process is presented. The hybrid PDK permits direct integration of Au-free III-V devices into CMOS circuits on a common Si-CMOS platform for high performance analog/RF, mixed-signal, digital or optoelectronic interconnect designs. It facilitates electrical information sharing between CMOS and III-V devices on a schematic design with foundry-proven back-end multi-layer metal interconnects in a single chip fabrication. It provides a motivation in fabricating integrated CMOS and III-V devices with commonly used CMOS libraries and III-V parameterized cell libraries within shorter design circle times for high-frequency, high-voltage, and high-power applications.