TechConnect News
Subscribe | Past Issues
January 2013 Issue
Produced by TechConnect
picture
Filling the Global Innovation Pipeline

Innovation Pipeline Opportunities

Three co-located innovation to commercialization events:

 

Submissions due - January 30th

TechConnect World
May 12-16, 2013, D.C.
» Call for Innovations!
due - January 30, 2013

National Innovation Summit
May 12-16, 2013, D.C.
» Call for Innovations!
due - January 30, 2013

National SBIR Conference
May 14-16, 2013, D.C.
» Call for Innovations!
due - January 30, 2013

line
TCWorld 2013 May 12-16, 2013, Washington, DC
Co-located with the

NISS 2013
May 13-16, 2013, Washington, DC

NSBIR
May 14-16, 2013, Washington, DC

- Innovation Submissions Due January 30, 2013!

line

Funding Opportunities

Department of Defense (DOD)

Platelet Storage Technologies
Deadline: January 28, 2013

Asia-Pacific Technology and Education Program
Deadline: February 11, 2013

DoD Clinical and Rehabilitative Medicine Assistive Technologies Research Award
Deadline: March 13, 2013

Expeditionary Maneuver Warfare Applied Research and Advanced Technology Development
Deadline: April 15, 2013

Science, Technology, Engineering
Deadline: September 30, 2013

AFRL Research Collaboration Program
Deadline: January 19, 2018

National Science Foundation (NSF)

Cyber-Physical Systems
Deadline: January 29, 2013

Small Business Technology Transfer Program Phase I
Deadline: February 6, 2013

EPA/NSF Networks for Sustainable Molecular Design and Synthesis
Deadline: March 18, 2013

Department of Energy (DOE)

Electrochemical Storage Technologies Suitable for Automobile Industry Applications
Deadline: January 31, 2013

Solid-State Lighting Manufacturing Research & Development - Round 4
Deadline: February 21, 2013 line

Become a Newsletter Sponsor Today:

Reach thousands in the global technology business community today! Contact Jennifer Rocha for more details.
Rieger Dimovski

Corporate Spotlights

BASF

Corporate Spotlight Interview: BASF - The Chemical Company - Dr. Jens Rieger, Senior Vice President, Advanced Materials and Systems Research-Technology Incubation, BASF SE and Dr. Svetlana Dimovski, Manager, Open Innovation and Science Relations, BASF North America speak to TechConnect News about BASF's technology and investment areas of interest

Wigel Intel

Spotlight Interview: Lorie Wigle, General
Manager, Eco-Technology Program Office,
Intel Corporation
- TechConnect World corporate speaker Lorie Wigle tells TechConnect News about Intel’s technology and solution areas of interests.

Ansems-Bancroft Dow

Corporate Spotlight Interview: Ms. Patricia Ansems-Bancroft, Fellow, Dow Corporate Venturing, Core R&D The Dow Chemical Company - Speaking at TechConnect World 2013, Ms. Ansems-Bancroft tells TechConnect about Dow's technology and investment areas of interest.

line

Electronics & Microsystems

Researchers at RMIT University have created "liquid metal marbles" - droplets of liquid metal coated in nanoparticles - The development advances research into soft electronics and industrial sensing technologies.

New 2D material for next generation high-speed electronics - Scientists at CSIRO and RMIT University have produced a new two-dimensional material that could revolutionize the electronics market.

Chemicals & Materials

Breakthrough Iron-based Superconductors Set New Performance Records - New fabrication method could advance technologies ranging from medical imaging devices to grid-scale energy storage.

Research Team from Three Countries Develop New Nanotech Fiber with Robust Handling and Unmatched Performance - Developed at Rice University, team believes nanotube fibers have unmatched strength, conductivity, and flexibility.

Energy & Cleantech

Innovation Spotlight: Silicon Carbide Wideband Semiconductors - TechConnect Innovation Tracking: United Silicon Carbide, a TechConnect Accelerator participant-ARPA-E Energy Innovation Summit, 2012

Innovation Spotlight: Light to Liquid - Comprehensive engineering for fuel from plants - TechConnect Innovation Tracking: Wisconsin Institute for Sustainable Technology, a TechConnect Accelerator participant, ARPA-E Energy Innovation Summit, 2012.

Health Sciences & Biotech/Pharma

Australia and US Research Institutions Come Together to Create Biotech Assets Start-Up - New company to focus on the development of small molecule drug candidates and bio targets to prevent and treat cancer.

New technology allows scientists to capture and preserve cancer cells circulating in the bloodstream - RIKEN in Japan and University of California Los Angeles developed a novel nanoscale Velcro-like device.

Innovation & Investment

Major Patent Law Changes: First-to-File Provisions - Effective March 16, 2013 - Now is a good time to start planning for the changes in March by reviewing patent portfolios and invention disclosures.

Hawaii Energy Excelerator For Seed and Start Up Companies Accepting Applications - Pacific International Center for High Tech Research has launched Hawaii's first clean energy business accelerator program

National Innovation Summit and Showcase May 13-16, 2013, Washington, DC

Share your technology, licensing, and investment stories with us!

Please contact Jennifer Rocha with your news item, and we may feature it in an upcoming edition.
Published by: Jennifer Rocha, Publishing Director

TechConnect is a global technology outreach & development organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world’s top corporate, investment, and government professionals. TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California.
Publishing Office: 955 Massachusetts Ave. #313 • Cambridge MA 02139, U.S.A.