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January 2014 Issue
Produced by TechConnect
Pipeline Opportunities

TechConnect World-National Innovation Summit-National SBIR Conference 2014, Innovation Partnering Program:
» Call for Innovations • Deadline: Friday, January 31, 2014

Next Events

TechConnect World Summit, Expo & Conferences 2014

June 15-19, 2014 • Washington, DC 

» Website: Now Accepting Innovation 

National Innovation
Summit, & Showcase 2014

June 15-19, 2014 • Washington, DC 

» Website: Now Accepting Technology Submissions and Offering Partnership Opportunities.

National SBIR/STTR Conference

June 16-18, 2014 • Washington, DC 

» Website: Now Accepting Innovation and Showcase Submissions.

Become a Newsletter 
Sponsor Today:

Reach thousands in the global
technology business community
today! Contact Jennifer Rocha
for more details.


TechConnect World
Nanotech and Cleantech Proceedings 2013 now Available.

An authoritative and comprehensive compendium for all participants in the nano revolution, from researchers and engineers to investors, consultants, and attorneys.

For purchasing info, view here.

Technology News: Advanced Materials |
Electronics & Sensors | Pharma & Biomaterials | 
Energy & Efficiency
| Tech & Commercialization | Fed Funding

Advanced Materials

TechConnect Innovation Spotlight: Environmentally Safe Plastic Microbeads for Cosmetics - College of William & Mary, TechConnect World-National Innovation Summit 2013 Awardee, Washington, DC.

Electronics & Sensors

Staying cool in the nanoelectric universe by getting hot - Research hints that nanodevices in microcircuits can protect themselves from heat generation; could boost computing power without large-scale changes to electronics.

Fujitsu Simulates 3,000-Atom Nano device, a Threefold Increase- Supercomputer used to calculate electrical properties in approximately 20 hours.

TechConnect Innovation Spotlight: Peel-and-Stick Process: Fabrication process for thin film electronics on universal substrates - Stanford University, TechConnect World-National Innovation Summit 2013 Participant, Washington, DC.

Pharma & Biomaterials

MIMETAS and Galapagos to Develop Human Disease Models On-a-Chip - The two companies have entered into a research collaboration on the development of organ-on-a-chip-based human disease models for new medicine development.

TechConnect Innovation Spotlight: Modular Biocompatible Materials for Medical Devices and Wound Healing Applications - DiazaMED, TechConnect World-National Innovation Summit 2013 National & Global Innovation Awardee, Washington, DC.

Energy & Efficiency

Solar-power device would use heat to enhance efficiency - New approach developed at MIT could generate power from sunlight efficiently and on demand.

TechConnect Innovation Spotlight: Embedded Photonic Crystals for Use in LEDs and Lasers - University of California at Santa Barbara, TechConnect World-National Innovation Summit 2013, Washington, DC.

EV Infrastructure:
Special Joint Webinar with National Grid and Austin Energy
Complimentary Webinar! Space is Limited! Register Today!

Investment & Commercialization

National Innovation Summit, Washington DC: Final Call for Innovation Submissions - Co-located with TechConnect World and National SBIR/STTR Conference, join North America's largest technology-to-commercialization event in the nation's capital. Submissions due January 31.

Wal-Mart Pledges $10 Million in Innovation Funding for US Manufacturing - Announcement was made by Wal-Mart CEO Bill Simon during the US Conference of Mayors in DC this month.

Federal Funding Opportunities

National Science Foundation (NSF):

Promoting Research and Innovation in Methodologies for Evaluation
Deadline: February 21, 2014

Exploiting Parallelism and Scalability
Deadline: February 24, 2014

Cyber-Innovation for Sustainability Science and Engineering
Deadline: April 8, 2014

Department of Energy:

Hydrogen Delivery Technologies
Deadline: February 14, 2014

Vehicles Technologies Incubator
Deadline: February 28, 2014

Department of Defense:

DIA Innovation - Agency Wide BAA
Deadline: November 26, 2014

BROAD AGENCY ANNOUNCEMENT (BAA), Energy Conservation Applications for the US Navy
Deadline: November 30, 2014

National Institute of Standards and Technology:

Summer Undergraduate Research Fellowship (SURF) Program
Deadline: February 14, 2014

Share your technology, licensing, and investment stories with us!

Please contact Jennifer Rocha with your news item, and we may feature it in an upcoming edition.
Published by: Jennifer Rocha, Publishing Director

TechConnect is a global technology outreach & development organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world’s top corporate, investment, and government professionals. TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California.

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