TechConnect Innovation
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September 2016 Issue
Produced by TechConnect
 TechConnect News - Innovation Prospecting Upcoming Deadlines

Defense Innovation Technology Acceleration Challenges:
DITAC 2016, Nov. 29 - Dec. 1, Austin, TX

Energy • Cyber • Medical • Materials • Systems


» Submit Abstract

Due Sept. 30

 Next Events
Gaylord National

Defense Innovation Technology Acceleration Challenges (DITAC)

Nov 29-Dec 1, 2016 • Austin, TX
» Register Today!

TechConnect World
Innovation Conference

May 14-17, 2017• Washington DC
» Save the Date!

National Innovation
Summit & Showcase

May 14-17, 2017• Washington DC
» Submissions Now Open!

National SBIR/STTR Conference

May 14-17, 2017 • Washington DC
» Save the Date!

Federal Funding Opportunities:

Environmental Protection Agency (EPA):

SBIR Phase I Solicitation
Deadline October 20, 2016

National Science Foundation:

Deadline: Rolling

Condensed Matter and Materials Theory
Deadline: Rolling

Energy for Sustainability
Deadline: October 20, 2016

Biological and Environmental Interactions of Nanoscale Materials
Deadline: October 20, 2016

Deadline: October 20, 2016

Department of Defense:

DoD Reconstructive Transplant Technology Development Award, Department of the Army
December 14, 2016

 TechConnect Innovator Spotlights:

Active technologies seeking collaboration and funding opportunities. Featured innovators participated at the 2016 TechConnect World conference, Washington, DC.

Printed Organic Sensors, using polymer inks with piezoelectric, pyroelectric or electrostrictive properties, on Large Area Flexible Surfaces, CEA Tech - Innovative polymer materials, such as PVDF-TrFE, exhibits electrical properties similar to the existing conventional inorganic compounds. As they can be easily formulated in liquid solutions, these inks (combined with additive printing techniques, e.g. screen-print) allow the manufacturing of large area, flexible surfaces sensitive to touch, pressure or proximity. View Summary Here.

Compact Laser Spectroscopy for Downhole Applications, National Energy Technology Laboratory, Department of Energy - NETL has developed a new laser-induced breakdown spectroscopy (LIBS) design for that detects and measures of the concentration of elements. This device is ideal for a wide range of industrial applications and because of its innovative construction, can be produced at lower cost than the competition, while providing greater functionality. View Summary Here.

NanoMet: Automated Dimensional Analysis of Nanomaterials, FullScaleNANO, Inc. - FullScaleNANO created a new software called NanoMet to convert images of nanomaterials into usable data. NanoMet is objective software that yields thousands of measurements in seconds at a cost of penny's per measurement. It is easy to use, reliable, fast and available as a webapp or customized service. View Summary Here.

  Increase Your Innovation Pipeline!

TechConnect delivers the world’s top vetted innovations to leading corporate, government, and investment executives. Become a 2017 TechConnect Corporate Acceleration Partner and increase your innovation pipeline with the largest pool of pre-vetted, early-stage technology opportunities. To learn more, click here.

2016 Corporate Partners Included:

2016 Corporate Partners

 TechConnect Innovation Updates
Defense Innovation Technology Acceleration Challenges - Nov. 29-Dec. 1, 2016, Austin, TX   National SBIR/STTR Conference - May 14-17, 2017,  Washington, DC
TechConnect World Conference and Expo - May 14-17, 2017 - Washington, DC National Innovation Summit & Showcase - May 14-17, 2017 - Washington, DC
 GridNext - Connecting Power, Connecting Poeple - Nov. 9-11, Georgetown, TX

Share your technology, licensing, and investment stories with us!

Please contact Jennifer Rocha with your news item, and we may feature it in an upcoming edition.
Published by: Jennifer Rocha, Publishing Director

TechConnect is a global technology prospecting and accelerator organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world's top corporate, investment, and government partners. TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California.

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