TechConnect Summit 2008 Now Accepting IP and Ventures for Conference Consideration; Final Round Deadline is March 14

Summit Will Bring Exclusive Technology Matchmaking and Corporate Partnering Opportunities for the Nanotech, Clean Tech, and Life Sciences Sectors

The annual TechConnect Summit is the world’s largest peer-vetted deal flow for technology Partnering, Investing and Licensing. The Summit is unique in that it brings together annually the world’s top technology transfer offices, companies, and investment firms to locate the most promising technologies and early stage companies from around the world.

TechConnect is currently accepting technology intellectual property (IP), early stage company, and corporate needs presenter abstracts for its upcoming TechConnect Summit 2008, to be held June 3-5 at the Hynes Convention Center, Boston, MA, USA. The final deadline to submit to the Summit is March 14, 2008. More than 150 IP and Early Stage Company submissions have already been received by TechConnect.

The TechConnect Summit will also feature a Corporate Needs program in which leading companies present their current and future technology needs to a targeted audience of technology developers and investors. Confirmed speakers for the 2008 TechConnect Summit include: Air Products & Chemicals, BASF, Boeing, Cabot Corporation, Eastman Kodak, Genzyme, Honda, Lockheed Martin, Medtronic, Merck, Omron, and Sanyo.

All submissions are peer-reviewed by a 70+ member TechConnect Advisory Board, which includes representatives from BASF, Boston University, Cabot Corporation, Honda, In-Q-Tel, Medtronic, Philips, Pfizer, Procter & Gamble, Sanyo, UCLA, Yale University, and many others. All accepted submissions will have the opportunity to present their technology, venture, or corporate needs talk at the Summit, be featured prominently on the Summit web pages and program, and receive access to exclusive networking and matchmaking events.

To submit an IP, please visit

To submit an Early Stage Company, please visit

The Summit is also offering limited speaking opportunities through our Sponsorship levels, which provide maximum exposure for a university or company before, during, and after the Summit. To learn more about these exclusive partnering opportunities, please download the Media Kit at:

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