TechConnect World Venture Forum To Take Place June 21, 2012, Santa Clara Convention Center! Submission Deadline is February 10th!

TechConnect Venture Forum is for start up companies to present their market advantages and search for corporate partners and funders.

The seventh annual TechConnect Venture Forum will take place Thursday, June 21 at the Santa Clara Convention Center, Santa Clara, CA. The Forum will open with a Corporate Venture Capital Program, followed by an afternoon of start-up business pitches, and conclude with a networking reception with global business and investment executives. All activities will take place in the Innovation Showcase Hall at the Convention Center.

All presenters will be pre-screened by the TechConnect Advisory Committee, which includes members representing leading business, investment, and research organizations from around the world.

Presenting companies range from seed level up to B-round stages of financing, and the companies are seeking investments, corporate partners, or both.

The TechConnect World Venture Forum represents more than a dozen industry sectors impacted by emerging technologies, including advanced materials, semiconductors, renewable energy, traditional energy, electronics, and biotech/pharma. TechConnect is pleased to have the support of the National Venture Capital Association and National Association of Seed & Venture Funders. Leading corporate and venture firms participate in the company review process including Atrium Capital, BASF Venture Capital, Chevron Technology Ventures, GM Ventures, Harris & Harris, In-Q-Tel, Intel, NanoDimension AG, Panasonic Venture Group, Rockport Capital, and Sofinnova Ventures. To submit your early stage company for conference consideration (Deadline is February 10), visit: To learn more about the Innovation Showcase Expo and discount pricing package to display your company’s advanced technologies, visit:

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