Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2015Advanced Manufacturing, Electronics and Microsystems TechConnect Briefs 2015

MEMS & NEMS Devices & Applications Chapter 8

Advanced Packaging for Next Generation Imaging and Sensor Devices

J. Kulick
Indiana Integrated Circuits, LLC, United States

pp. 315 - 318

Keywords: interconnect, packaging, microelectronics, imaging, sensors

Quilt Packaging is a unique and versatile edge-interconnect technology that utilizes “nodule” structures that extend out from the vertical facets along the edges of chips to allow for inter-chip communication. QP has demonstrated world-record chip-to-chip interconnect performance, reduces size, weight, and power requirements, and enables entirely new system designs. The QP interconnect structures, or “nodules,” can be customized to enable precision alignment, dense I/O pitch, extremely low-loss microwave transmission, and high-power current-handling capability. The myriad of benefits Quilt Packaging offers make it useful in many application spaces. The high-performance electrical interconnect and potential for heterogeneous integration allow new levels of integration in RF devices. Applications that use large chips, such as large-format imaging arrays, stand to benefit from the modular Quilt assembly method which allows assembling smaller chips into arbitrarily large arrays with minimal chip-to-chip gaps. Stitching together a large array from smaller pieces can dramatically improve fabrication yield and open up new possibilities in array sizes. Orthogonal and curved Quilt Packaging present new opportunities in device design for MEMS sensors and imaging arrays.