Informatics, Electronics and Microsystems: TechConnect Briefs 2017Informatics, Electronics and Microsystems TechConnect Briefs 2017

Nanoelectronics Chapter 2

CarrICool – the Innovative 3D Interposer Platform for HPC Systems: Analysis, Simulations, Optimization, Practice for Reliability Improvement and Performance Increase

G. Janczyk, T. Bieniek, P. Bajurko
Instytut Technologii Elektronowej, Poland

pp. 47 - 50

Keywords: HPC, CarrICool, interposer, signal integrity, interconnect, TSV, coplanar line, microchannel, liquid cooling

This paper presents specific solutions being developed in frame of the CarrICool (abbr. “Modular Interposer System Architecture providing scalable Heat Removal, Power Delivery and Optical Signaling”) European FP7 project. The presented research and developed solutions are dedicated for HPC computer systems to extend critical capabilities of integrated circuits performance by application of the innovative CarrICool interposer module. Research efforts performed by the project consortium are focused on several fields like cooling efficiency improvement over 600W/cm2, optical communication compatibility assurance, power delivery optimization and electrical communication and signaling. Tha aim is to develop (design and fabricate) and test in hardware a set of 3D interconnecting structures, bulk converters, optical links and cooling channels inside the dedicated CarrICool Interposer module.