TechConnect Summit-IP and Venture Submission Deadline is Fast Approaching! Submissions Are Due February 12, 2010

F1000 Companies, Universities, and Young Companies Converge For Corporate Partnering and Technology Matchmaking Opportunities

The next TechConnect Summit will take place June 21-25, 2010, in Anaheim, CA. TechConnect is the largest conference for technology commercialization and corporate-investment partnering in North America. The TechConnect Summit features peer-reviewed technologies (IPs) and early stage companies (Ventures) from around the world representing more than a dozen industry sectors.

Universities and companies selected for the Summit present to a targeted audience of F1000 corporate business and science developers, investors, researchers, and international government agencies. All IP and Venture submissions are reviewed by a 70+ member Advisory Committee representing F500 corporations, university technology transfer offices, and investment firms.

Fortune 500 Corporate Partners
The TechConnect Corporate Partnering Forum is for F500 business and science development executives present their company’s technology and investment areas of interest. More than a dozen F500 companies have already confirmed their participation for 2010 in Anaheim, including:

*New for 2010

How to Participate:

Submit an IP (Deadline is February 12, 2010)
The TechConnect IP Forum is for those that generate new technology and are looking for firms that are interested in licensing that technology, or are looking for potential investment partners to take their technology to the next stage. Those selected to present will give an oral presentation at the Summit, receive Advisory Committee feedback, and access to exclusive receptions with corporations and investors.

To submit an IP, please click here . The deadline to submit is February 12, 2010.

Submit a Venture (Deadline is February 12, 2010)
The Venture Forum is dedicated to “seed” up to “B Round” companies to showcase their technologies, market advantages, and search for corporate partners and funders. Those selected to present will give an oral presentation at the Summit, receive Committee feedback, and access to exclusive receptions with corporations and investors.

To submit a Venture, please click here . The deadline to submit is February 12, 2010.

Exhibit at the TechConnect Marketplace
Special Pricing Available for Qualified Universities and Start-Up Companies

The TechConnect Marketplace Expo is for universities, start-up ventures, and companies to showcase technologies, products and services to conference attendees. Networking receptions with F1000 executives, extended Expo hours, and booth discounts for university tech transfer offices and early stage companies that present at the Summit are just a few of the new features for 2010. To learn more, please click here

Become a Sponsor
Companies seeking to maximize their opportunity to find promising technologies, work with young companies, and support technology research and innovation should consider sponsoring the Summit. TechConnect offers sponsors benefits that maximize visibility to the technology business community and provides high-quality industry and technology knowledge for sponsors. To view sponsor packages, click here

Please visit and bookmark the 2010 TechConnect page at: http://www.techconnect.org/Summit2010/ or contact Jennifer Rocha for more information.

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