TechConnect Summit Announces Final Call for IP and Venture Submissions

Submissions Due January 28th, 2009
Join top universities, F500 corporations, and start-up companies at the fastest growing Marketplace for emerging technologies.

The TechConnect Summit will take place May 3-7, 2009 at the George R. Brown Convention Center in Houston Texas. The annual TechConnect Summit connects innovation technologies and promising start-up companies to a global audience of market leaders from the business and investment communities. The Summit also features exclusive presentations from Fortune 500 companies that focus on their technology challenges and investment areas of interest in clean technology, nanotechnology, and life sciences.

TechConnect is currently seeking IP and Venture submissions for conference consideration. Through the IP and Venture Forums, TechConnect helps universities and early-stage companies showcase their technologies or business plans to larger corporations and investors, encourage academia-industry partnerships, and provide access to funding opportunities. All accepted IPs and Ventures are given presentation slots in the program and benefit from increased visibility at the leading event for the global technology business community.

New For 2009
The Summit will feature the TechConnect Marketplace—a unique exhibit hall for universities, companies, and government agencies to showcase their patent portfolios, prototypes, and services to thousands from the global technology and business communities.

Corporate Partners
TechConnect’s Corporate Partnering Presentations have often been one of the highlights of the Summit. This year, more than a dozen companies will discuss their current technology projects, as well as highlight how they work with universities and start up companies on technology development and commercialization. Confirmed corporations include: Air Products & Chemicals, Applied Materials, BASF, Eastman Kodak Company, Genzyme, Honda Motor Corporation, Lockheed Martin, Medtronic, Merck, Omron, Sanyo, and Siemens. Dow Chemical, GlaxoSmithKline, GE Healthcare, and 3M have reserved speaking slots in this program.

Submissions for the TechConnect IP and Venture Forum are being accepted until January 28th. For more information, please visit: http://www.techconnect.org/Summit2009/ or contact Jennifer Rocha at: Jrocha@techconnect.org.

Exhibitor and sponsorship opportunities are also available for community members looking to find buyers or investors for their technology & business solutions. Corporate technology and investment executives from Fortune 1000 companies and private equity firms are expected to attend the TechConnect Marketplace. To view the list of past participating attendees, speakers, and exhibitors, please visit: http://www.techconnect.org/Summit2009/press/past_participants.html. Contact Jrocha@techconnect.org for more details on exhibiting or sponsoring.

Registration is now open for the TechConnect Summit 2009! Take advantage of early bird savings, which are valid through March 13. Online registration can be found at: http://www.techconnect.org/Summit2009/register.html. Discounted hotels rates are also available for conference attendees: http://www.techconnect.org/Summit2009/venue/hotels.html.

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